LASER-INDUCED SELECTIVE PLATING OF DIELECTRICS FOR ELECTRONIC CIRCUIT FABRICATION

Electric circuit traces formation on 3D shaped dielectrics is one of the biggest challenges in 3D Mechatronic Integrated Devices (3D-MID). The advanced technology of Selective Surface Activation Induced by a Laser (SSAIL) can solve emerged production issues for electric traces. The process can be applied almost on any commercial dielectric material by adapting laser and chemical parameters. Narrow copper lines below one micrometre in a width) are feasible to produce. The technology is capable to fabricate a metallic mesh with metal wires less than 5 µm in diameter to be invisible but still electro-conductive. Therefore, such metallic mesh can substitute Indium Tin Oxide (ITO) in the transparent conductive film market.

Ready for the integration in production lines.

Patented (WO 2018051210; JP 6749482; LT 6518; US 10982328; EP 3512980; CN 109844178; KR 102319221

• Industrial Electronics manufacturers.
• Partners for global marketing.
  
  

Dr. Karolis Ratautas

Phone +370 618 42061; e-mail: karolis.ratautas@ftmc.lt