Microwave research equipment |
In the microwave laboratory there are microwave anechoic chamber designed for measurements in the frequency range from 800 MHz to 20 GHz. The dimensions of the chamber are 8.4 m×4.6 m×3.7 m. Our chamber partly conforms to IEC EN 61000-4-3 standard for electromagnetic emission measurements and fully conforms to requirements for the measurement of electronic equipment susceptibility to electromagnetic radiation.
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Available in the lab high power microwave pulse sources generate up to 100 kW (up to 20 kV/m) microwave pulses in the frequencies 2.65 GHz, 5.7 GHz, 9.2 GHz and 15 GHz. Also we have a set of tunable microwave amplifiers those generate up to 2 kW power microwave pulses in the frequency range from 1 GHz to 18 GHz.
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In our new anechoic chamber we can perform measurements of electromagnetic properties like dielectric permittivity, absorption, shielding effectiveness of various functional materials and coatings at free space conditions.
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Development of resistive sensors – devices for high power microwave pulse measurements - is one of the objectives of our laboratory. Resistive sensors are based on electron heating effect. Electric field of microwave signal getting into sensor heats electrons in it and the resistance of the sensor increases. By measuring this resistance change the microwave pulse power in the waveguide is determined. New generation of the resistive sensors is implemented in the double ridge waveguides and their frequency band was expanded more than two times.
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Using high power microwave pulse sources and resistive sensors we can perform measurements of electromagnetic susceptibility of the electronic equipment to high power microwave radiation. The main advantage of our technique is based on the increased measurement accuracy of the amplitude of the electric field by which the device under test is subjected. On the one hand, we are using the resistive sensor for the exact measurement of the microwave power passed to the transmitting antenna, being able to calculate the electric field strength at the location of the device under test. On the other hand, electric field strength is measured directly by using the resistive sensor connected to the horn antenna.
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Together with experimental investigations we are also solving electromagnetic wave scattering problems. Using finite difference time domain method the electromagnetic wave propagation in various environments and their interaction with different objects are modelled. We are also performing the simulations of electromagnetic properties of microwave and terahertz electronic components.
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Thin film deposition
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PVD platform Angstrom Engineering EvoVac Platform is used for deposition of metal oxide thin films and metals by RF, DC, pulsed DC and HiPIMS sputtering. Argon and/or oxygen ion beam processing can be used for cleaning and film enhancements.
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Plasma Enhanced Chemical Vapour Deposition (PECVD) system SVCS PECVD system consist of two furnaces with maximal temperature up to 1000 0C and is used for formation of graphene and SiNx, SiO2, Al2O3, SiC layers
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Thermal processes Tube furnace Nabertherm RS 120/1000/11 (photo) is used for diffusion and thermal oxidation of silicon. Sulfidation of Mo/MoOx precursor into a few monolayer MoS2 can be performed in this furnace. Maximal temperature in the tube is 1100 0C in oxygen, dry air or inert gas atmosphere. Drying chamber BINDER FDL 115 is used for drying various solvents. Rapid thermal processing system Unitemp RTP-100-HV can be used for rapid thermal annealing of thin films.
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Laboratory of chemical processes Laboratory is in ISO 7 cleanroom equipped with fume hoods, laminar flow hoods used for preparation of the surface of semiconductor wafers, spin coating of the films and wet etching.
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Device prototyping
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Laser lithography system Heidelberg instruments DWL 66+ The DWL 66+ laser lithography system is a high resolution pattern generator for low volume mask making and direct writing. Generated structure size is down to 600 nm.
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Semiconductor processing equipment Oxford Instruments
The equipment set is designed to: deposit a dielectric layer for a hard mask (PECVD), etch the mask itself (RIE), etch the semiconductor substrate (ICP-RIE).
PECVD - Oxford Instruments PlasmaPro 80 PECVD
PECVD tool is used for the deposition of dielectric layers. The standard processes are designed for the deposition of SiO2 and Si3N4 layers. The tool is equipped with high and low frequency plasma generators, which can be combined to change the layer stress. The standard process temperature is 300℃. Gases used in the tool: SiH4, NH3, N2O, Ar, CF4.
RIE - Oxford Instruments PlasmaPro 80 RIE
Dry etching tool for mask formation. Standard processes are designed to etch SiO2 and Si3N4 layers. Gases used in the tool: CF4, Ar, CHF3, O2.
ICP-RIE - Oxford Instruments PlasmaPro 100 Cobra ICP180
Dry etching tool for semiconductor etching. The temperature of the sample table can be changed from -20℃ to +60℃. Materials that can be etched with standard recipes: GaAs; InP. Gases used in the tool: Cl2, BCl3, CH4, H2, SF6, O2, N2 Ar.
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Optical microscope High quality optical microscope (magnification up to 1600x) for alignment to lithographic markers on the wafer and visual control of lithography process.
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Mask aligners Mask aligners Karl Suss MJB3 and Kulicke-Soffa with alignment accuracy of 1.5 µm.
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Assembly equipment Diamond scriber OptoPhase mr200 for scribing wide range of materials from semiconductors (Si, GaAs, GaSb, InP, GaP) to glass and quartz. Semi-automatic digital wedge/ball/bump bonder TPT-HB10 for bonding Au and Al wires.
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Test and Diagnostic Equipment |
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Semiconductor characterization system Keithley 4200-SCS/Summit 11000 is aparameter analyser, and it delivers synchronizing current-voltage (I-V), capacitance-voltage (C-V) and ultra-fast pulsed I-V measurements in a temperature range from room temperature to +350 0C.
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Scanning Probe Microscope Dimension 3100 Microscope is used for a mapping surface 3D topography, mechanical, electrical and magnetic properties, manipulating of nanoobjects on the surface, investigate effects of electric field or mechanical force to the surface, perform force (intermolecular, electrical etc.) spectroscopy. Measurements can be performed in air or liquid at room temperature.
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Photoelectrical characterisation system A steady state solar simulator Sciencetech SS1,6kW (AM1.5G spectrum) and source meter Keithley 2601 for photoelectrical characterisation of solar cells or photoactive materials.
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Software
SPIP 5.1.0 (Image Metrology) is an advanced software package for processing and analyzing microscopy images at nano- and microscale. SPIP supports many microscope types including scanning probe microscopes (SPM, AFM, STM, SNOM), electron microscopes (SEM, TEM), interference microscopes, confocal microscopes, optical microscopes and profilers along with their file formats.
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